Chiplets built with YorChip's Universal PHY and UniPack advanced packaging lower the system size, weight, cost and power.
The chiplet revolution promised fast time to market — but has stalled at the cost barrier and time to market barriers.
Our patented, 100% digital architecture built for interoperability,lowest area cost, lowest latency and portable to any node and foundry. We offer a free MPW license if developing your chiplets with us.
Architected from the ground up for extreme efficiency and density.
Compared to standard UCIe solutions, dramatically reducing die footprint and silicon cost.
Unmatched power consumption — less than 0.1 picojoules per bit transferred across chiplets.
Universal compatibility across foundries, from legacy mature nodes to cutting-edge processes.
Developing off-the-shelf chiplets so you don't have to.
Every metric tells the same story — outperforming legacy approaches across the board.
Built-in reliability and up to wafer-scale integration.
Ensures Known Good Die (KGD) qualification and enables real-time redundancy — critical for high-reliability deployments in critical Physical AI systems.
Patented packaging solution allows integration of UCIe, HBM, LPDDR and all common PHY interfaces, passives with optional cooling built-in for maximum integration support.
Three streamlined steps from concept to production.
Use existing Open Chiplets to skip costly verification cycles and start physical integration immediately.
Access regular MPW runs on mature nodes for faster qualification and earlier revenue generation.
Work directly with YorChip to transition your custom ASIC from concept to production — without delay.
The future of silicon is modular, cost-effective, and accessible. Whether you're an IP designer, SoC architect, or startup — YorChip's platform is ready for your vision.
Integrate your IP into the P.A.C.E. ecosystem and reach a global audience of modular chiplet builders.
Build next-generation chiplet-based systems with proven, production-ready universal PHY.
Innovate without the $10M barrier — get to market faster with lower cost and with best in class advanced packaging.
Reach out to our team today and discover how YorChip powers the Physical AI Age.